Wafer

Due to high added value in the production steps it is important to guaranty a frictionless operation and to avoid shutdowns in the production e.g. by breakage of wafers. Therefore wafers with structural defects, for e.g. cracks, saw marks or chippings should be detected and sorted out.

We help you with our customer-specific inspection modules: 

• Geometry
  With lateral resolutions down to 10 µm the wafer geometry can be determined with high accuracy. Also defects like chippings can be detected easily.
  
  • LOADER

• Topography
  The topography on both sides can be determined with resolutions down to 1 µm perpendicularly to the wafer surface. Therewith it is possible to detect small saw marks or chippings besides the recording of statistical data like thickness or bending.

• Microcracks
  The transillumination of wafers with infrared light makes microcracks reliably visible. By the use of new technology false positives will be minimized.
  
  • TAURUS
  • ANTARES

• Grain Analysis
  By using the natural grain structures one has the possibility of tracking the wafer during the manufacturing and assigning them to their position in that block. Furthermore the grain structure of each wafer can be characterized inline for following sorting processes.
  
  • GEMINI Grain Analysis
  • GEMINI Quality Tracking